IC Package L & C

Cable and Connector Development

Accurate Impedance Measurements

Create SPICE Models & Eye Diagrams

IC Package & Board Failure Analysis

TDR is a novel approach in locating the position of failures in BGA and similar packages and printed circuit boards. IConnect TDR software improves the resolution of TDR, facilitating easier location of open and short faults. Easy waveform manipulation and analysis makes the TDR data much easier to interpret. Finding the location of open faults and signal-to-ground shorts becomes a simple task, and finding location of plane-to-plane shorts, signal-to-signal shorts, resistive shorts and faults in fanouts become realistic tasks.

Click (HERE) to download Electronic Package Fault Isolation Using TDR 
Locate Opens/Shorts in IC Packages and Boards