For package, socket and connector designers, IConnect provides a capability to quickly and easily compute your package, socket, connector L and C, using either the JEDEC and IBIS industry standard computation procedure, IConnect MeasureXtractor™ automatic modeling tool, or additional differential and single ended TDR modeling procedures. To measure the input or output capacitance of the IC I/O buffer, the same modeling procedures can be applied. Click (HERE) to download Computing IC Package Self and Mutual Capacitance and Inductance Using Even and Odd TDR Measurements. Capacitance of an IC I/O buffer,