GigaProbes(tm) Customers

Hewlett Packard

Apple Computer

Nanolab Technologies

Verigy (Germany and China)

Raytheon

Net Insight AB

Mflex

Juniper Networks

National Semiconductor

Oracle

Gregorio Larosa Consulting

Qualcomm

Hitachi (two locations)

Sun Microsystems

Scientific Atlanta

Navy

Research In Motion (RIM)- Canada

R&D Circuits

AMCC (Applied Micro Circuits Corp.)

Toshiba America Electronic Components

Agami Systems

Comtech EF Data

SliceX

(AMD) Advanced Micro Devices

Microsoft

Lockheed Martin Space Systems Company

Nuova System

ARM

Centre de Physique des Particules de Marseille

LSI Logic (5 locations)

Lucent Technologies

Mitac (Singapore)

Phillips Semiconductor (France)

Extreme Networks

Seagate Technologies (5 locations)

Thales Communications

Cisco Systems

SuperMicro

Network Appliance

Brocade Communications

FormFactor, Inc. (3 locations)

Nvidia (3 locations)

LeCroy (S Korea)

LeCroy (Switzerland)

Finisar

Sandisk (2 Locations)

Juniper Networks

Aga`mi Systems

Cerexx

Sierra Video Systems

• USB 3 COMPLIANCE TESTING
  
• PCI EXPRESS GEN 2
  
• SATA/SAS MIDPLANE INTERCONNECT COMPLIANCE TESTING (ONLY PROBE CAN MAKE DIFFERENTIAL EVEN MODE TEST)
  
• ATE Test Head (Load Board) Bandwidth and Impedacne Testing
  
• CPU backplane development
  
• 6.25G/bit Device Test board and back plane interconnect analysis.
  
• Back plane to daughter board interconnect analysis with LeCroy WaveExpert TDR system
  
• Impedance and S-parameter testing of filter networks used for communication systems. Probes used with Tektronix TDS8200 and IConnect software.
  
• Test 50 and 100 ohm Impedance lines on bump side of CPU package.  Improves productivity by 10x over current testing methods.
  
• Xbox PCB impedance analysis
  
• Military Systems
  
• Sensor Impedacne testing using TDR or Impedance Analyzer

• High speed G/bit serial interconnect designs. Differential impedance and S-parameters using a Tektronix TDR and IConnect.
  
• Device evaluation test boards.  Measure TDR impedance and S11 s-parameters from Socket to SMA connector using Tektronix CSA8200 TDR and IConnect SI software
  
• CPU Controller board development
  
• IC evaluation board development
  
• Ethernet Network backplane Impedance testing

• Commercial CPU backplane/ daughter board development
  
• Package and IC socket Analysis
  
• RAID backplane Impedance testing using Tektronix TDS8200 and IConnect
  
• Disk drive controller development
  
• Military communication equipment development
  
• PCIXII GigaBit development
  
• Verifying PCB manufacture is meeting impedance specifications
  
• Daughter card to backplane impedance analysis and spice modeling
  
• Gigabit Switch Backplane development
  
• Field Service of probe card interconnect with their Tektronix DSA8200/80E01 50Ghz TDR system. The GigaProbes(tm) are connected directly to the 80E01 TDR sampling module making it easy to probe and troubleshoot the probe card interface to find opens/shorts.
  
• Validating impedance of test cards interconnects. Differential and Single ended GigaProbes(tm) give them greater impedance test options.
  
• Used to demo LeCroy WaveExpert TDR systems to customers in Korea. Offers greater interconnect measurement flexibility beyond SMA connections. A total TDR probing solution
  
• Sold to customers that have purchased LeCroy WaveExpert TDR system in Switzerland
  
• Impedance testing of device development test boards
  
• Impedance tests of high speed memory boards to include creating IConnect(r) models and S - parameters of test boards. Self C calculation are also modeled on sockets.
  
• Gbit Serial interconnect system design. Using LeCroy WaveExpert to measure differential TDR and real-time S-parameters to validate channel bandwidth.
  
• PCB manufacture to verify PCB impedance. Used the Gigaprobes micro manipulator (GPMMA) adapter to probe 12Ghz boards to verify impedance specifications.